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This product is made of etched antenna+PET material, using reverse packaging technology for wafer bonding, combined with RFID technology, and meets the EPC C1G2 (ISO 18000-6C) standard, suitable for global use. The surface material is laminated with copperplate paper and can be printed. Widely used in retail industries such as jewelry, diamonds, watches, etc.

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This product is made of etched antenna+PET material, using reverse packaging technology for wafer bonding, combined with RFID technology, and meets the EPC C1G2 (ISO 18000-6C) standard, suitable for global use. The surface material is laminated with copperplate paper and can be printed. Widely used in retail industries such as jewelry, diamonds, watches, etc.

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